UPSIREN UX PRO Ultra 50g jar High-viscosity nonconductive thermal putty for 24 mm gaps. Hand moldable compound for water cooling plates, desktop...

Engineered for water cooling and other big coolers: bridges coldplate tolerances that ordinary paste cant, delivering real contact to GDDR6/GDDR6X modules, VRM stages and controllers. High viscosity, hand moldable body lets you shape the layer exactly where needed; remains cohesive under pressure and resists pumpout during prolonged high-temperature operation. Creates a stable 24 mm interface across mixed height component clusters and around standoffs and frame edges, improving uniformity without stacked pads. Maximum possible thermal conductivity for a nonconductive putty (16.8 W/m·K*) while remaining electrically safe for dense SMD layouts. 50 g capacity suits small shops and frequent users; decant working amounts to minimize exposure and keep the main jar sealed for consistent texture over time. UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIA GeForce RTX 3080/3090/4080/4090 boards, AMD Radeon RX 6800/6900/7900 series, and other systems that use thermal p

UPSIREN UX PRO Ultra 50g jar High-viscosity nonconductive thermal putty for 24 mm gaps. Hand moldable compound for water cooling plates, desktop...

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