Purpose built for thin form factor cooling: wicks into micro gaps and holds shape under clamp pressure, helping low profile heat sinks move heat away from GDDR6 VRAMs, VRM stages and controller chips without relying on a perfect pad thickness. Packaging advantage 10 g jar: pocketable supply for single devices or short runs; reseals cleanly between steps and reduces waste while still servicing multiple components on a laptop mainboard. Soft, lightly tacky consistency that is easy to place and adjust; adheres gently so the layer doesnt skid during assembly, yet is smooth enough to feather edges and avoid spillover on dense boards. Ideal thickness around 12 mm provides a stable interface across mixed component heights, a practical fix when stock pads are slightly short, stiff, or leave corners uncovered. Electrically nonconductive with 12.8 W/m·K* thermal conductivity and broad operating stabilitysuited to extended gaming sessions and productivity loads with frequent temperature swings. U