Phase-change performance: softens around 45°C to flow and wet interfaces, then resolidifies on cooldown to lock in a thin, uniform bond line that lowers thermal resistance during repeated on/off cycles. 8.5 W/m·K* conductivity in a non-electrically conductive formulationsafe near exposed pads and viassupporting stable temps on CPUs/GPUs, VRAM heat spreaders, PCH/SoC packages, and compact vapor chamber lids. Sized 40×40×0.25mm for broad coverage; can be trimmed to shape with scissors or a craft knife for chiplets, laptop dies, or console APU footprints without fraying or crumbling. Durable under heat: tested for high temperature tolerance and repeated thermal cycling, helping maintain contact quality through years of gaming, rendering, or workstation loads. Synergy with our putties: combine PTM7950 by CSGR® on the die/flat interface and K5 PRO/U6 PRO/UX PRO Ultra on surrounding components with larger gaps to create a complete, uniform thermal path. PTM7950 by CSGR® is compatible with Pl