The X-10 dry socket paste consists of a silicone-based carrier material to which aluminum and aluminum oxide powder are added. The mixing ratio is coordinated in such a way that viscosity is achieved, which allows easy application of the paste. At the same time, X-10 thermal glue is viscous enough to offer some resistance to the pump-out effect. The mixing ratio of X-10 is balanced to achieve good thermal conductivity, making this product the best heat sink compound available in the market. For spanish pasta termica para pc gamers