K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and other components where thermal pads are originally used. K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc). K5-PRO can replace soft thermal pads that are used on computers (best performance up to 1mm, maximum gap that can be filled up to 3mm). K4-PRO has thermal conductivity K>4,6 W/mK * (3 times higher than common thermal pastes that are used on computers and commercial electronics). K5-PRO has thermal conductivity K>5,3 W/m.K * (at least 3 times higher than common thermal pads that are used on computers and commercial electronics). K5-PRO is applied very easily directly on the component and has no electrical conductivity. Operational temperature -90 to 250 degrees (Celsius). K4-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 220 degrees (Celsius) and has a long operational life time.