Insulated 0.02mm 120M Phone Motherboard Fingerprint Jump Wire Soldering Pure Copper Conductor Wire for Phone PCB BGA Soldering Repair

Designed with ultra-fine diameter to make precise connection and avoid short-circuit between 0.1mm solder joints. Used for iPhone Fingerprint Repair / PCB BGA Soldering Point, or other other small soldering point The conductor wire is not enameled wire, It's made of pure copper, and the surface is conductive The jump wire is small and easy to be straightened, and the diameter is around 0.02 mm We ensure the high-quality which are not easy to be stretched.

Insulated 0.02mm 120M Phone Motherboard Fingerprint Jump Wire Soldering Pure Copper Conductor Wire for Phone PCB BGA Soldering Repair

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