About this item Power amplifier chip with over 90% power efficiency and low idle loss characteristics. Advanced modulation system configuration reduces the number of components and includes an integrated self-protection circuit with overvoltage, undervoltage, overheating, DC detection, and short circuit protection, all in a heat-resistant package. Equipped with surface-mounted capacitances. Features European-style 3P wiring terminals. Large heatsink chip for convection-type heat dissipation. Dimensions: 6.42 x 4.49 x 0.75 inches.